|product name||Titanium and titanium alloy target block, titanium cake|
|standard||Titanium round target: technical condition: comply with GB/T2695-1996, ASTMB348-97 Titanium plate target: technical condition: comply with GB/T3621-94, ASTM B265-93|
|Specification||Round target: Common specifications: 60/65/95/100*30/32/40/45mm Plate target: (8-25)mm * (150-300) mm * (1000-2500)mm Tube target: 70mm * 7mm /10mm|
|surface||Polished, can be threaded|
|characteristic||Light weight, excellent corrosion resistance, corrosion resistance, high strength, good heat resistance, good ductility, non-toxic, non-magnetic, excellent mechanical strength, etc.|
|state||Annealed state (M) Hot processed state (R) Cold processed state (Y) (annealed, ultrasonic flaw detection)|
|application||Used in semiconductor separation devices, flat-panel displays, storage electrode films, sputtering coatings, workpiece surface coatings, and glass coating industry|
Titanium cake, titanium target block material requirements
Purity is one of the main performance indicators of the target, because the purity of the target has a great influence on the performance of the film. However, in practical applications, the purity requirements of the target are also different. For example, with the rapid development of the microelectronics industry, the size of silicon wafers has grown from 6″, 8″ to 12″, while the wiring width has been reduced from 0.5um to 0.25um, 0.18um or even 0.13um, and the previous target purity was 99.995% It can meet the process requirements of 0.35um IC, while the preparation of 0.18um lines requires 99.999% or even 99.9999% of the target purity.
Impurities in the target solid and oxygen and moisture in the pores are the main pollution sources of the deposited film. Target materials for different purposes have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.
In order to reduce the pores in the target solid and improve the performance of the sputtered film, the target is usually required to have a higher density. The density of the target affects not only the sputtering rate, but also the electrical and optical properties of the film. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target makes the target better able to withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators of the target.
|product name||purity||density||Coating dominant color||shape||Regular size||Application industry|
|Titanium Aluminum (TiAl) Alloy Target||2N8-4N||3.6-4.2||rose gold/coffee gold||Cylindrical||diameter|
|pure titanium（Ti）target||2N8-4N||4.51||gold/gun black/blue/rose||Cylindrical||diameter 60/65/95/100*30/32/40/45mm||Decoration/Tools|
|Pure zirconium（Zr）target||2N5-4N||6.5||gold||Cylindrical||diameter 60/65/95/100*30/32/40/45mm||Decoration/Tools|
|pure aluminum（Al）target||4N-5N||2.7||silver||Cylindrical||diameter 60/65/95/100*30/32/40/45mm||Decoration/Tools|
|pure nickel（Ni）target||3N-4N||8.9||Metal color||Cylindrical||diameter 60/65/95/100*30/32/40/45mm||Decoration/Tools|
|Nickel vanadium（Nir）target||3N||8.57||blue-green||Cylindrical||diameter 60/65/95/100*30/32/40/45mm||Decoration/Tools|
|Pure Tantalum（Ta）target||3N5||16.4||black purple||Cylindrical||diameter 60/65/95/100*30/32/40/45mm||Decoration/Tools|
|Chemical composition reference standard|
|Grade||Al||V||N≤||C≤||H≤||Fe≤||O≤||other elements (single)||other elements (sum)|
|Mechanical performance reference standard|
|Grade||Mechanical properties at room temperature, not less than|
|tensile strength||Yield Strength||Elongation||rate of reduction in area|